Description
Thermal Dissipation Product
Our product is made by incorporating fillers into the matrix, designed to dissipate heat without being electrically conductive, thus functioning as insulators. This material is enriched with boron components, alumina, and other specialized fillers. The thermal conductivity capacity is measured in W/m-K.
Standards
The product complies with the MIL I 49456 standard, which defines its characteristics and performance.
Properties
The material can exhibit varying Shore A hardness, allowing for perfect flatness between two contacting surfaces. This approach optimizes heat dissipation.
Applications
It is particularly suitable for situations where effective thermal dissipation is necessary, considering the heat generated by electronic devices within enclosures. Our products offer various thicknesses and thermal parameters ranging from 0.9 to 3.5 W/m-K, and can include structured adhesives to facilitate positioning.
Supply
The material is available in sheets of various thicknesses and can be provided custom-made to ensure optimal application on electronic circuits or metallic components, such as die-cast aluminum.
